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As a cost-effective and fast alternative for PCB in small series, Becker & Müller offers customers the special PCB-Mix. With this production method multiple orders from different customers – with the same copper thickness and layer build-up – are placed and manufactured together on one production panel. The available specifications of the PCB are more narrowly defined in the PCB-Mix. By that, costs of material, setup and handling can be reduced. The design rules and the available PCB-Mix services (see table below) are to be observed.
The production method for the PCB-Mix enables us to offer the PCB, compared to usual sample production, with the same quality more cost effective. Such „pools“ usually have disadvantages, such as an uneven layer thickness distribution due to the different layouts of the individual PCB. At Becker & Müller we avoid this disadvantage by using a special copper plating process – so-called pulsplating.
With increasing quantities, manufacturing using the PCB-Mix does no longer pay off, we manufacture then in the standard sample or series production.
| Material | FR4 1.5 mm standard layer build-up |
| Layers | 2L, 4L, 6L |
| Copper thickness | 35 μm, 70 μm |
| Solder resist | green |
| Surface | HAL, chem. Sn |
| Silk screen | white (optional) |
| Trace width/distance | ≥ 0,15 mm (6 mil) |
| Drill diameter | ≥ 0,3 mm (12 mil); no blind and buried vias |
