High-current and thick-copper PCB
High-current and thick-copper PCB
The accommodation of power electronics and the associated extremely high current intensities require special specifications of the carrier circuit boards. The focus is on the profile of the copper traces – copper layers of up to 1,000 μm on inner/outer layers enable an optimal flow of current while keeping the trace heating limited. At Becker & Müller we use copper foils in thicknesses of 105/200/400/1,000 μm for the production of high-current and thick-copper PCB. Further thicknesses and special inlays with inlaid copper parts are also on request available.
For what are high-current and thick-copper PCB needed?
Application areas of high-current and thick-copper PCB are everywhere where high currents or a special heat management are required. Current examples, in additions to general power supply, are also drive technology – keyword e-mobility – as well as converters for solar and wind power plants.
In order to meet these (new) technical requirements, thermal management, reduction of size and assembly costs are required. Even the intention to integrate control and power sections together on one circuit board pose challenges for developers, layouters and PCB manufacturers – see here also our copper-inlay-technology below.
In manufacturing of high-current and thick-copper PCB a special challenging part is to ensure the uniformity of the etched trace layout as well as the fully covering application of the solder mask. Here there are special design rules such as trace width/distance etc. to observe. By years of experience as well as a high process reliability in production at Becker & Müller these requirements are implemented with absolute reliability. In order to be able to use all the possibilities of this technology optimally, a coordination between developer, layouter and PCB manufacturer is decisive. We at Becker & Müller will be happy to be available to our customers personally as a development partner for individual advices.
Advantages of high-current and thick-copper PCB
As an experienced manufacturer of high-current and thick-copper PCB Becker & Müller is very familiar with the specific advantages. These include in particular:
- direct heat dissipation -> Components can be fitted and soldered directly with a copper core that protrudes from the FR4 insulation at crucial points
- copper layers on the remaining areas of the PCB can be selected as desired -> fine pitch elements can be used
- saving of space (by integration of control and power unit)
- simplification of assembly and cost reduction (by saving of fasteners)
In demanding performance areas such as high-current and thick-copper circuit boards especially the coordination between developer, layout and PCB manufacturer is indispensable. We at Becker & Müller as an experienced professional in PCB manufacturing are happy to be available to customers for individual advices – either via phone or directly at the customer’s.
Copper-inlay-technology
The use of copper-inlay-technology enables to integrate the power and control part on a single circuit board without mutual influence. The power section requires large and coarse structures to transport the extremely high currents respectively to be able to optimally dissipate the heat development. The control section on the other hand needs fine structures on which there is a lower current flow. The challenge is to combine both sections on a single circuit board. Here we at Becker & Müller are experienced specialists.
The copper-inlay-technology offers a method with which copper inlay cores with a thickness of up to 4 mm – standard inlays measure 1 mm – can be inserted in a multilayer or directly applied on the surface of the PCB. To make optimal use of the possibilities of this technology a coordination between developer, layouter and PCB manufacturer is crucial. That is why we at Becker & Müller are already at the DFM process (Design For Manufacturing) personally available.
Advantages of copper-inlay-technology:
- copper inlay core up to 4 mm thickness
- direct heat dissipation -> copper core that protrudes from FR4 at critical points, directly fitted and soldered with components
- saving of space
- reducing costs (by saving of material and components)
- current strength up to 1,000 A
- inlay can act as a conductor as well as a heat sink
Unsere PCB Sondertypen
Flex & Starrflex PCB
Starrflex-Leiterplatten kommen dort zum Einsatz, wo Leiterplatten im Betrieb mechanischer Bewegungen bzw. Schwingungen ausgesetzt sind oder die räumlichen Verhältnisse keine andere Lösung zulassen.
Wir bei Becker & Müller zählen zu den spezialisierten Herstellern von Starrflex- und Semiflex- Leiterplatten und stehen Ihnen gerne bereits in der Entwicklungsphase zur Verfügung.
Hochfrequenz-PCB
Hochfrequenz-Leiterplatten (HF) finden überall dort Anwendung, wo schnelle Signalflüsse und damit hohe Übertragungsfrequenzen gefordert werden. Um die Integrität der HF-Signalflüsse bei möglichst hoher Grenzfrequenz gewährleisten zu können, müssen die zulässigen Parameter präzise ermittelt und umgesetzt werden. Wir bei Becker & Müller sind hierbei Ihr kompetenter Hersteller und Entwicklungspartner.
Impedanzkontrolliert
Impedanzkontrollierte Leiterplatten werden bei hohen Frequenzen und steilen Schaltflanken zur Sicherstellung der Signalintegrität eingesetzt. Durch Reflektionen kann es zu Überlagerung der Signale kommen, was zu Fehlern und Unzuverlässigkeit der gesamten Baugruppe führen kann. Becker & Müller ist Ihr Spezialist für die Herstellung impedanzkontrollierter Leiterplatten.
Hoch-Tg
Hoch-Tg-Materialien weisen, im Vergleich zu Standard FR4-Materialien, eine höhere Temperaturbelastbarkeit auf. Zum Einsatz kommen sie überall dort, wo besondere Temperatur- oder Strombelastungen auf die Leiterplatten einwirken und eine erhöhte Dauerbetriebstemperatur für die Zuverlässigkeit der PCB erforderlich ist.
Hochstrom PCB
Das Unterbringen von Leistungselektronik und die damit verbundenen extrem hohen Stromstärken fordern besondere Spezifikationen der Trägerleiterplatten. Wir von Becker & Müller haben dafür maßgeschneiderte Lösungen für die Herstellung von Hochstrom-/ Dickkupfer-Leiterplatten.
Alukern / IMS
Alukern-Leiterplatten – auch IMS (Insulated Metallic Substrate) genannt – finden bei auftretenden mechanischen, primär aber bei thermischen Belastungen Anwendung. Der Kern der Leiterplatte besteht dabei komplett aus Aluminium und ist durch eine Isolationsschicht vom Leiterbild getrennt.
Specials
Von Kantenmetallisierung (“DK-Konturen”), Spezialkonturen, Senkungen und Tiefenfräsungen, Blind Vias, Buried Vias, Stecker, spezielle Oberflächen oder farbige Lötstopplacke, Bestückungsdruck, Abdeckfolien und Abdecklack, Plugging und vieles mehr: Wir von Becker & Müller sind der ideale Hersteller und Entwicklungspartner, wenn es um ganz spezielle Sondertypen von Leiterplatten / PCBs geht.
