Blind vias and buried vias are used for design optimization of the PCB layout.
A blind via is a plated-through hole between the outer and one or more inner layers. A buried via, on the other hand, denotes the plated-through hole between two or more inner layers.
The advantage of both via types is the increase of packing density of the circuit board and the associated reduction in dimensions. Please note our design-rules.
Released connection areas on the PCB are coated with a final surface finish after application of the solder mask. This coating protects against oxidation of the otherwise exposed copper and thus increases the shelf-life duration of the finished circuit board. Another advantage is the favoring of the later soldering process.
The following surface finishes can be selected for the coating:
The surface finish is to be selected depending on the area of application and requirements. We are happy to advise you on the selection.
To be able to meet our demand for the promised fast delivery times we have an extensive stock of base materials. Next to common standard materials also various exotic base materials of different dimensions and thicknesses are available directly from stick. An excerpt of the most common materials is:
Other base material types are also available on request. We are happy to advise you in selection of suitable materials for your application.
In addition to our extensive range of base materials, our material storage also contains different types of copper foils. The following thicknesses are available from stock: 9/12/18/35/70/105/200/400 μm. More copper foils are available on request.
Thermal management includes, in addition to heat dissipation, protection from the effects of heat from the environment. With this in mind, we have developed an innovative process that allows us to bond printed circuit boards with solid ceramic blocks. These act as thermal insulators and protect the subsequent assembly. For more information about this process, please contact us.
Suitable thermal management can massively increase reliability and service life. To improve heat dissipation, the circuit board can be connected to external heatsinks – e.g. a metal carrier made of aluminum. These reduce thermal resistance, increase thermal conductivity and thus act as passive heat sinks. The process can be combined with all technologies. Depending on the requirements and the environment, the connection can be made by bonding or – analogous to multilayer production – by pressing.
To achieve the opposite effect, we have developed a process by which the printed circuit boards are connected with solid ceramic blocks. These act as thermal insulators and protect the PCB from the effects of heat. For further information please contact us.
Quality is our top priority! Our company is certified according to quality management standard DIN EN ISO 9001:2015.
In addition, our circuit boards go through a wide variety of measurement and testing procedures which enable us to control and guarantee the quality standards.
Documenting our quality is equally important. In addition to e-test protocols, initial sample test reports and impedance control reports, further customer-specific measurement and test reports can also be created. Micrographs of individual circuit boards can also be made and evaluated.